Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology
Invensas Will Demo xFD Solutions at IDF Beijing and Present at the
International Conference on Electronics Packaging in Tokyo
SAN JOSE, Calif.--(BUSINESS WIRE)--
Invensas Corporation, a leading provider of semiconductor technology
solutions and wholly owned subsidiary of Tessera Technologies, Inc.
(Nasdaq: TSRA), today introduced its DIMM-IN-A-PACKAGETM multi-die
face-down (xFD)TM technology for thin and light notebooks,
also known as UltrabooksTM, and tablet computers.
Invensas' novel solution delivers the memory capacity and performance of
a small outline dual in-line memory module (SODIMM) in a miniature,
soldered-down, ball grid array (BGA) package. Although the number of
dynamic random access memory (DRAM) chips may vary depending upon the
architects' need, a DIMM-IN-A-PACKAGE incorporating one typical product,
the Quad Face Down (QFDTM) package, can replace a
single-sided SO-DIMM in a 16 x 16 x 1.0mm form factor, making it ideal
for today's ultra-thin electronics.
"Right now, portable electronics roadmaps demand not just evolutionary
products to reduce size and increase performance, but revolutionary
solutions that provide a radical simplification of the product design
and the supply chain," said Simon McElrea, president of Invensas. "The
memory challenge goes well beyond providing the required capacity. It's
about creating solutions that significantly reduce motherboard size and
complexity, while increasing battery size (and hence life), and then
dealing with all the heat. DIMM-IN-A-PACKAGE addresses all these issues
simultaneously."
Invensas will offer demonstrations of its xFD solutions in booth GE23 at
the Intel Developer Forum (IDF) taking place April 11 and 12, 2012 at
the China National Convention Center in Beijing. Invensas will present
its Ultrabook DIMM-IN-A-PACKAGE solution at the International Conference
on Electronics Packaging (ICEP) at Tokyo Big Sight in Tokyo, Japan.
Titled "A multi-die DRAM package for solder-down memory in Ultrabook and
Tablet PC applications" and coauthored by Dell Inc., the paper will be
part of the technical session program taking place in Room B at 10:50 AM
on Friday, April 20, 2012.
Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
features, benefits and characteristics of Invensas' DIMM-IN-A-PACKAGE
multi-die face-down (xFD) technology and Invensas' participation
at IDF and ICEP, as well as the subject matter of Invensas'
presentations at such events. Material factors that may cause results to
differ from the statements made include changes to the plans or
operations relating to Tessera Technologies, Inc.'s (the "Company")
businesses; market or industry conditions; the future expiration of
license agreements and the cessation of related royalty income; the
failure, inability or refusal of licensees to pay royalties; delays,
setbacks or losses relating to the Company's intellectual property or
intellectual property litigations, or any invalidation or limitation of
key patents; fluctuations in operating results due to the timing of new
license agreements and royalties, or due to legal costs; changes in
patent laws, regulation or enforcement, or other factors that might
affect the Company's ability to protect or realize the value of its
intellectual property; the risk of a decline in demand for semiconductor
and camera module products; failure by the industry to adopt
technologies covered by the Company's patents; the future expiration of
the Company's patents; the Company's ability to successfully complete
and integrate acquisitions of businesses, including the pending
acquisition of Flextronics's camera module business in Zhuhai, China;
the risk of loss of, or decreases in production orders from, customers
of acquired businesses; financial and regulatory risks associated with
the international nature of the Company's businesses; failure of the
Company's products to achieve technological feasibility or
profitability; failure to successfully commercialize the Company's
products; changes in demand for the products of the Company's customers;
limited opportunities to license technologies and sell products due to
high concentration in the markets for semiconductors and related
products and camera modules; the impact of competing technologies on the
demand for the Company's technologies and products; failure of the
Company's subsidiary, DigitalOptics Corporation, to become a vertically
integrated camera module supplier; and the reliance on a limited number
of suppliers for the components used in the manufacture of DigitalOptics
products. You are cautioned not to place undue reliance on the
forward-looking statements, which speak only as of the date of this
media alert. The Company's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year ended
Dec. 31, 2011, include more information about factors that could affect
the Company's financial results. The Company assumes no obligation to
update information contained in this press release. Although this press
release may remain available on the Company's and Invensas' website or
elsewhere, its continued availability does not indicate that the Company
is reaffirming or confirming any of the information contained herein.
About Invensas Corporation
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies,
Inc. (Nasdaq: TSRA
- News),
acquires, develops, and monetizes strategic intellectual property (IP)
in areas such as circuitry design, memory modules, 3-D systems, and
advanced interconnect technologies, to serve the dynamic mobile, storage
and consumer electronics sectors. The group is headquartered in San
Jose, California. For information call 1-408-321-6000 or go to www.invensas.com.
Invensas and the Invensas logo are trademarks of Invensas Corporation or
its affiliated companies in the United States and other countries. All
other company, brand and product names may be trademarks or registered
trademarks of their respective companies.
TSRA-G
Company:
Moriah Shilton, 408-321-6713
Sr. Director,
Corporate Communications & Investor Relations
or
PR:
Impress
Labs
Amy Smith, 401-369-9266
amy@impresslabs.com
Source: Invensas Corporation
News Provided by Acquire Media
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